TSM

Taiwan Semiconductor Manufacturing Company

research_scan theme='chips-compute'; value_chain_position='picks-and-shovels'; Sole leading-edge foundry for Blackwell/Blackwell Ultra/Vera Rubin plus binding CoWoS-S/L packaging capacity. July 2026 revenue +44.7% YoY, August 2026 +53.3% YoY / +10.1% MoM, YTD +39.3% — the foundry-tier print continues to accelerate rather than compress, contradicting the C-04 capex-side compression path on criterion #26 while ratifying C-26 rent migration to the digital upstream-monopoly tier.